Vacuum diffusion bonding device
Diffusion bonding of various metals! Introducing micro-diffusion bonding devices and high-frequency heating diffusion bonding furnaces.
We would like to introduce the vacuum diffusion bonding equipment handled by Atotech. The "micro diffusion bonding device," which bonds metals at the atomic level, is designed and manufactured using our vacuum technology. It is capable of bonding the same materials as well as different materials. Additionally, the "high-frequency heating diffusion bonding furnace" can efficiently perform diffusion bonding in a short time and can be used for diffusion bonding of various metals up to φ30. 【Micro Diffusion Bonding Device Specifications】 ■ Pressurization method: Weighted method using weights and levers ■ Overheating dimensions: 40φ×40H ■ Overheating method: High frequency, programmable temperature control ■ Maximum overheating temperature: 1400℃ ■ Vacuum level: ×10-5PA ■ High-frequency power supply: 20KW *For more details, please refer to the related links or feel free to contact us.
- 企業：アトーテック
- 価格：Other
